Smooth and straight connections must be created at PCB (Printed Circuit Board) layout. BGA pins may need to be re-assigned, if the BGA is re-configurable, but that's necessary to keep signals and ...

Standard ball-grid array (BGA) technology was developed as a response to increasing densities required by applications such as high-speed data transfer. Although widely accepted, BGA does have its ...

Diagram of a ball grid array (BGA). Engineers can use digital image correlation (DIC) to assess its thermal expansion or warpage due to thermal, mechanical and thermo-mechanical loads. DIC is an ...

Memory chip packaging designs changed significantly when the industry moved from SDR to DDR. Some common DRAM packaging includes Thin Small-Outline Package (TSOP), Chip-Scale Packaging (CSP), ...