The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the ...

Ball grid array (BGA) reworking typically involves de-soldering and resoldering the chip to remove defective components and mount new ones. However, it’s a complex task, and people can easily make ...

FocalSpot has announced a new addition to its line of BGA/SMT inspection and rework systems, the Concept FX multi-axis x-ray inspection system with 80/90/130 kV x-ray source options, six-axes of ...

SMD components may be a little challenging for the home builder – even though the’re inordinately practical for homebrew PCBs – but if you play around with electronics and solder long enough, you’re ...

The female SF-BGA1152A-B-42 socket and the LS-BGA1152A-41 ball-grid-array (BGA) surface-mount (SMT) male pin unit serve as a low-cost and reliable adapter set for Xilinx's 1152-pin BGA ICs. The ...