PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...
To support the increasing demand for scalable electromagnetic analysis, Ansys is introducing a new HFSS-IC product family. HFSS-IC Pro, with RaptorX™ technology embedded, is certified by TSMC for its ...
Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...
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