In PCB manufacturing, the hole size to thickness ratio , also known as the aspect ratio , is a critical factor that influences the quality of hole plating. This ratio is calculated by dividing the PCB ...

While ultra HDI may receive considerable attention for stacked vias, staggered vias are a smart choice in many designs. The structure, offsetting each microvia, permits the dielectric to absorb ...

A reduction of silver consumption in PV production is required on the way to terawatt scale. Given this, the time may have come for the commercialization of new copper plating technologies – doing ...

Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...

Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...