Global Die-Attach Materials Market to Reach $834 Million by 2026 Die-attach also known as die bonding relates to the method of affixing a semiconductor die to a substrate (such as a PCB board), or to ...

Using a chip-first die attach process, this investigation will address die shift and deformation using various release and thermoplastic bonding materials. Combinations using different EMC products ...

QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

Fundamental materials properties of the plated layer (such as purity and microstructure) are critical for die attach and wirebond, and the specific plating strategies that can yield these properties.

Dublin, April 19, 2024 (GLOBE NEWSWIRE) -- The "Die-Attach Materials - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering. Global Die-Attach Materials Market ...

The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...

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LAB ID offers customized ultrahigh-frequency (UHF) RFID and Near Field Communication (NFC) tags, as well as dual-frequency RFID tags that combine both technologies. The company also provides services ...

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