TL;DR: JEDEC has released the HBM4 DRAM standard, enhancing bandwidth up to 2 TB/s, doubling channels, and improving power efficiency and capacity for high-performance computing, AI, and graphics.

AMD submitted a patent to the World Intellectual Property Organization (WIPO) for a groundbreaking new memory architecture that can significantly enhance the performance of the DDR5 standard. The ...

A new HBF 3D flash stack is similar to HBM for use in AI processing. HBF capacity will be much higher, allowing static ...

These modules are meant for registered server memory ecosystems like cloud servers and AI training clusters, not AM5 or ...

The JEDEC Solid State Technology Association (JEDEC) has announced the publication of its next-generation high bandwidth memory (HBM) DRAM standard. The JESD270-4 HBM4 standard delivers higher ...

At long last, HBM4 is officially here—at least as a specification. The JEDEC released Standard 270-4, supplying high bandwidth memory (HBM) makers with a complete specification for what will likely be ...

The memory shortage, or to go by the more widely used nom de guerre of RAMageddon, has seen component prices skyrocket, lead times for hardware extend to the end of the decade, and cascaded into ...

As AI demand soars, global memory shortages are driving costs up and reshaping the tech landscape.

Micron Technology Inc. delivered solid profits today thanks to rampant demand for artificial intelligence chips that drove record quarterly revenue, but it wasn’t enough to move the needle in its ...

SK Hynix is partnering with flash memory manufacturer Sandisk to jointly promote the standardization of High Bandwidth Flash (HBF) technology. The two companies plan to leverage synergies with High ...

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. AI infrastructure cannot evolve at the speed of model innovation. Processor design cycles ...