Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing ...

A new technical paper titled “Augmenting Von Neumann’s Architecture for an Intelligent Future” was published by researchers ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Before the transition can be made from custom chiplet environments to a standardized off-the-shelf open marketplace, an ...

AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory ...

In the world of EDA, Jay Vleeschhouwer, managing director of software research at Griffin Securities, needs no introduction.

A new technical paper titled “Thin-film lithium niobate quantum photonics: review and perspectives” was published by ...

The Largest, Highest-Quality Dataset with a Preprocessing Framework for LLM-based RTL Generation” was published by ...

Despite the AI hype, ML tools really are proving valuable for leading-edge chip manufacturing. More aggressive feature ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of ...

A new technical paper titled “Efficient Hardware-Assisted Heap Memory Safety for Embedded RISC-V Systems” was published by ...

Free Analog Computing with Imperfect Hardware” was published by researchers at The University of Hong Kong, University of ...