By Milana Vinn and Amy-Jo Crowley NEW YORK/LONDON, March 13 (Reuters) - BE Semiconductor Industries has attracted takeover interest as its chip-packaging technology becomes increasingly strategic for ...

By Milana Vinn and Amy-Jo Crowley NEW YORK/ LONDON, March 12 (Reuters) - BE Semiconductor Industries has been fielding takeover interest, as demand for its chip-packaging technology has become more ...

The U.S. high-end semiconductor packaging market is valued at about USD 4.95 billion in 2025 and is projected to grow at a CAGR of 11.68% from 2026 to 2035, reaching nearly USD 14.93 billion. Growth ...

Tesla's Terafab project launches in 7 days, targeting 2nm chips, $25B investment, and 1M monthly wafer starts by 2030.

TAIPEI (Taiwan News) — Innolux has developed Fan-Out Panel Level Packaging technology for next-generation chips, transforming the panel maker into a supplier in the advanced semiconductor packaging ...

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...

ASML stock jumps 30% YTD as the chipmaking equipment leader pushes High-NA EUV technology forward and explores advanced AI chip packaging opportunities.

Absolics says its facility can currently produce a maximum of 12,000 square meters of glass panels a year. That’s enough, Lee ...

The world we are living in is increasingly becoming software-defined, where artificial intelligence (AI) is adding the next layer of functionality. And it’s driving the need for more compute to enable ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

India plans a new $11 billion semiconductor fund to boost domestic chip manufacturing, support supply chains, and strengthen the country’s position in the global semiconductor industry.

Semiconductor chips consist of dozens of layers, packing immense computing power into a compact form. They store and retrieve data for signaling and control and are essential in creating central ...