MILPITAS, CA – Worldwide silicon wafer shipments rose 3.1% year-on-year in the third quarter to 3,313 million square inches (MSI), according to the SEMI Silicon Manufacturers Group. The increase ...

Hirose expands its DF22 Series with the DF22B branch adapter, enabling compact, high-current power distribution and simplified cable management.

WASHINGTON, DC – Worldwide semiconductor sales reached $208.4 billion in the third quarter, rising 15.8% from the previous quarter, according to the Semiconductor Industry Association (SIA). September ...

Navigating change in tech isn’t just about tools. Research & development drives new technology, and new technology development fuels the lifeblood of technology, industrial and consumer companies.

FRANCE – The EIPC (European Institute for the PCB Community) is seeking abstracts for technical presentations at its Winter Conference, taking place February 3–4, 2026, in Aix-en-Provence, France.

RS's version 13 of its DesignSpark PCB software has enhanced graphics for smoother rendering, symbol origin alignment to improve placement accuracy and serpentine routing to support high-speed signal ...

PEACHTREE CITY, GA – CIRCUITS ASSEMBLY today announced the 2025 New Product Introduction (NPI) Award winners for electronics assembly equipment, materials and software. The 18th annual NPI Awards ...

MILPITAS, CA – Global silicon wafer shipments are projected to rebound 5.4%, rising from 12,165 million square inches (MSI) in 2024 to 12,824 MSI, according to the latest forecast from SEMI. The ...

TAIPEI – Taiwan-based Zhen Ding Tech Group announced that its subsidiary, Avary Holding, will acquire a 53.68% stake in China’s Wuxi Huayang Technology for $50 million, marking a strategic expansion ...

SAN JOSE, CA – Cadence Design Systems posted strong third quarter financial results, reporting revenue of $1.339 billion compared to $1.215 billion in the same quarter last year. GAAP operating margin ...

BANNOCKBURN, IL – The Global Electronics Association reported strong September results for the North American PCB industry, highlighting double-digit year-to-date gains in both shipments and bookings.

Microfill EVF-III electroplating is for via fill and through-hole plating for fine-line HDI circuit boards. Provides surface uniformity, reduced scratch mark sensitivity, and wider operation latitude ...