SEOUL, South Korea, Feb. 2, 2023 /PRNewswire/ -- LG Innotek (CEO Jeong Cheol-dong) is accelerating the business activities in full-scale for targeting the Flip-Chip Ball Grid Array (hereafter referred ...
IC backend houses are being encouraged to increase production capacity in Southeast Asia, especially for BGA packaging, according to industry sources. Save my User ID and Password Some subscribers ...
Comprising a small pc-board with decoupling capacitors on one side and solder balls on the other, the QStack power delivery module attaches directly underneath a BGA package to reduce or eliminate the ...
The SG-BGA-7163 BGA socket for 0.4-mm-pitch 221-pin BGA verifies IC function in a development system such as monolithic integration of GSM Baseband. Designed for 7.5 x 7.5 x 0.82-mm package sizes, the ...
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